Waferpedia

Comparison ledger

DCS 1460 Wafer Cleaner Spinversus1000FP

Disco DCS 1460 Wafer Cleaner Spin, YES 1000FP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DCSYES 1000FP
Specifications
ConfigurationTable upgrade for VCSEL cleaning[1]—
Maximum workpiece sizeΦ300 mm[2]—
Application frame2-12[2]—
Table RPM range100 to 3,000 min⁻¹[2]—
Setting time for cleaning/drying0 to 999 sec[2]—
Cleaning nozzle speed1 to 37.5 °/sec[2]—
Cleaning rangeΦ450 mm (up to 310 x 310 mm)[2]—
Cleaning pressure range2.3 to 11.8 MPa[2]—
Equipment dimensions (W×D×H)500 × 650 × 1,220 mm[2]—
Equipment weight (Dry mass)Approx. 144 kg[2]—
Max. workpiece sizeΦ300 mm[2]—
Table RPM100 to 3,000 min^-1[2]—
Cleaning nozzlesStandard high pressure cleaning nozzle; optional atomizing cleaning nozzle; dual nozzle configuration possible[2]—
Operator interface4 inch LCD touch panel[2]—
System type—Plasma cleaning system[3]
Line—R-Series Plasma Cleaning Systems (Glen Technologies)[3]
Model—Glen/YES 1000FP[3]
Designed use—Designed to accept a range of shelf sizes[3]
Application focus—Changing needs of the flat panel industry[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.com.sgdisco.com.sg
  3. [3]web.archive.orgweb.archive.org