Comparison ledger
CEE 300 Bake Plate, YES 12-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12-2P-CPYES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 300 Bake Plate | YES 12-2P-CP |
| Cited variants | ||
| Specifications | ||
| Wafer size | up to 300mm wafer[3] | 300 mm wafers[2] |
| Software | Internal OS[3] | — |
| Voltage | 208V[3] | — |
| Max Substrate Size | 300mm round or 12" x 12" square[1] | — |
| Min Substrate Size | 4 inch round[1] | — |
| Max Temperature | 300°C (400°C optional)[1] | — |
| Temperature Resolution | 0.1°C[1] | — |
| Temperature Uniformity | ±0.3% across working area[1] | — |
| Smart Pin Height Range | 0-19 mm[1] | — |
| Weight (machine only) | 146 lb (66.2 kg)[4] | — |
| Dimensions | 18" H x 18.75" W x 26.25" D[4] | — |
| Power | 3100-4100 watts[4] | — |
| Exhaust Port | 2" (50.8mm) OD[4] | — |
| Model designation | — | 12-2P-CP[2] |
| Series | — | YES-PB Series / 450PB Series[2] |
| Load type | — | manual load[5] |
| Application scope | — | MEMS and semiconductor process applications[6] |
| Cooling package | — | Air-only cooling package; no water[2] |
| Airflow | — | Vertical laminar airflow[2] |
| High vacuum | — | 10-6[2] |
| Maximum temperature | — | up to 450°C[2] |
| Interface | — | touch screen interface[6] |
| Tool type | — | manual-load high-temperature cure oven[5] |
| Process applications | — | MEMS and semiconductor process applications[5] |
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