Comparison ledger
CEE 1000 Hot Plate, YES 6-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 6-2P-CPYES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | YES 6-2P-CP |
| Cited variants | — | |
| Specifications | ||
| Configuration | 4"[2] | — |
| Type | Hot Plate[2] | — |
| Wafer Size | 4 inch[2] | — |
| Series | — | PB Series (manual load)[3] |
| Model | — | 6-2P-CP[1] |
| Wafer size | — | 150 mm wafers[1] |
| Process type | — | high temperature cure oven[3] |
| Operation | — | manual load[3] |
| Atmosphere/process control | — | dry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[3] |
| Cooling package | — | air only, no water[3] |
| Airflow | — | vertical laminar airflow[3] |
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