Waferpedia

Comparison ledger

MPA 600 Maskversus101

Canon MPA 600 Mask, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMCanonEV Group
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCanon MPA 600EV Group 101
Specifications
ConfigurationPart[1]—
OEM—EV Group[2]
Model—101[2]
Equipment name—EVG 101 Spray Coater[2]
NEMO ID—evgspraycoat[2]
Training required—EVG 101 Training[2]
Training duration—1.50 hours[2]
Processing technique—Resist Spray Coat (manual)[2]
Cleanliness—"All"[2]
Location—SNF Paul G Allen L107 Cleanroom[2]
Wafer diameter (substrate size)—up to 300 mm[3]
Available modules—Spin coat / OmniSpray® / develop[3]
Wafer handling options—Bowed / warped / thin wafer handling, edge handling[3]
Dispense options—Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3]
Processing technique (at SNF)—Resist Spray Coat (manual)[4]
Cleanliness group (at SNF)—"All"[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]snfguide.stanford.edusnfguide.stanford.edu
  3. [3]evgroup.comevgroup.com
  4. [4]snfguide.stanford.edusnfguide.stanford.edu