Waferpedia

Comparison ledger

2000 iW+ Ultrasonic Welderversus10490

Branson 2000 iW+ Ultrasonic Welder, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMBransonWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 2000West Bond 10490
Specifications
202.2[1]—
EPD101-162-115[1]—
ConfigurationBranson CJ 20 Transducer Converter:[1]—
EDP101-135-059[1]—
Diameter1 inch[1]—
Max BoosterGold[1]—
Manufacturer—West Bond[2]
Model—10490[2]
Description—Convertible bonder, wedge to ball[3]
Tool type—Convertible bonder[4]
Bonding modes—Wedge bonding and ball bonding[4]
Use—Wire bonding[4]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com