Comparison ledger
Branson 101-149-053 Gold Booster, Panasonic FCX 501 Flip Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | FCX 501 Flip ChipPanasonic |
|---|---|---|
| OEM | Branson | Panasonic |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Panasonic FCX 501 Flip Chip |
| Specifications | ||
| Configuration | 1:1.5[1] | — |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Bonding processes | — | Ultrasonic and thermosonic flip chip bonding (GGI, MDB)[4] |
| Bond type | — | Monometallic bond with high thermal and electrical conductivity[4] |
| Throughput | — | 3,600 UPH including bond time[4] |
| Accuracy | — | ±10 microns[4] |
| Bonder type | — | Thermosonic bonder[4] |
| Bond profiles | — | Up to ten-step bond profiles with digitally controlled force and ultrasonic power[4] |
| Wafer handling | — | Dual wafer option and automatic wafer feed[4] |
| Footprint | — | 1 meter x 1 meter including loader/unloader[4] |
| Vision system | — | Automatic vision recognition for precise die pick-up and bonding[4] |
| Unit vintage (per listing) | — | 2010, 2011[5] |
| Vintage (per listing) | — | 2010, 2011[6] |
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