Comparison ledger
Branson 101-149-053 Gold Booster, Palomar 3880-II, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | 3880-IIPalomar |
|---|---|---|
| OEM | Branson | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Palomar 3880-II |
| Specifications | ||
| Configuration | 1:1.5[1] | — |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | 3880-II[4] |
| Type | Gold Booster[2] | Automatic Die Bonder[5] |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Processes | — | Silver Sintering Die Bonding; Eutectic Die Bonding; Epoxy Die Bonding; UV Die Bonding; Solder Paste Die Bonding; Thermocompression Die Bonding[4] |
| VisionPilot with Vision Standardization | — | Uses advanced geometric pattern matching to locate parts that are randomly oriented or have greyscale variations, using boundary curves not tied to a traditional pixel-grid.[4] |
| Automated Tool Changer | — | Automated access to nearly unlimited tools; up to 8 tools can be loaded in the tool turret for near-instant access.[4] |
| Bond Data Miner | — | Centralized data management and analysis system for machine and process trend monitoring, storage, traceability, cross-platform data, closed-loop process control, yields, and predictive maintenance.[4] |
| High Force Tool Option | — | Provides high force while maintaining high precision for low-force operations and tight planarity control even for very large components.[4] |
| Pulsed Heat Systems | — | Computer-controlled heating solution for solder-based applications, available in several forms including a large surface area model and a tool-incorporated heating source.[4] |
| Placement Speed | — | 1200 UPH[5] |
| X Y Placement Accuracy (Repeatability) | — | 3.5 µm[5] |
| Theta Placement Accuracy | — | > 400 Degree[5] |
| Substrate Working Range | — | 914.4 x 508 mm[5] |
| Compressed Air | — | 4 bar[5] |
| Power Supply | — | 230 VAC, 50/60 Hz, 10A, Single Phase[5] |
| Overall Dimensions (W x D x H) | — | 1560 x 1510 x 1770 mm[5] |
| Net Weight | — | 1134 kg[5] |
| Force Range | — | up to 10 kg[6] |
| Tool Turret Capacity | — | up to 8 tools[4] |
| Bonding Method | — | Die Bonder[5] |
| Overall Dimensions | — | 1560 x 1510 x 1770 mm[5] |
| Repeatability | — | 3.5 µm[5] |
| Wafer Die attach | — | Yes[5] |
| Equipment type | — | Die Bonder[4] |
| Programming time reduction | — | up to 95%[4] |
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