Comparison ledger
Branson 101-149-053 Gold Booster, EV Group 850 Debonder, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | 850 DebonderEV Group |
|---|---|---|
| OEM | Branson | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | EV Group 850 |
| Specifications | ||
| Configuration | 1:1.5[1] | 50/60 Hz[4] |
| Manufacturer | Branson[2] | EV Group[5] |
| Model | 101-149-053[2] | 850 Debonder[6] |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Phase | — | 3 Phase[4] |
| Model designation | — | EVG®850 DB Automated Debonding System[5] |
| Function | — | Fully automated debonder for the separation and cleaning of processed temporary bonding wafer stacks[5] |
| Wafer diameter | — | Up to 300 mm[5] |
| Wafer size | — | 2, 3, 4, 5, 6, 8, 12 inch[6] |
| Electrical | — | 3 Phase[4] |
| Electrical frequency | — | 50/60 Hz[4] |
| Feature | — | Reliable handling of thinned, bowed and warped wafers with and without topography[5] |
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