Waferpedia

Comparison ledger

20 36 SurfaceversusDS 271

Blanchard 20 36 Surface, Meyer Burger DS 271, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
DS 271Meyer Burger
OEMBlanchardMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2010 Stated vintage
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceMeyer Burger DS 271
Cited variants—
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[2]With HDD & Software[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[2]—
Diameter—350 mm[3]
Length—1061 mm[3]
Weight—175 kg[3]
Number—2[3]
Required power—2 x 75 kW[3]
Bearing application—special roller bearings, water-cooled[3]
Horizontal distance between axes—660 mm[3]
Wire web working height—1515 mm[3]
Wire web width—1030 mm[3]
Loading length—1020 mm[4]
Max workpiece dimensions—220 x 220 mm[4]
Workpiece holders—4 x 255 mm, 3 x 340 mm, 2 x 510 mm, 1 x 1020 mm[4]
Wire diameter—100–160 micron[4]
Wire speed—15 m/sec[4]
Wire guide rolls diameter—350 mm[4]
Diamond wire upgrade—Water based upgrade installed[5]
Vintage—2010/2011[4]
Wire guide roller diameter—350 mm[3]
Wire guide roller length—1061 mm[3]
Wire guide roller weight—175 kg[3]
Wire guide roller count—2[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]tradekorea.comtradekorea.com
  5. [5]tradeindia.comtradeindia.com