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Comparison ledger

RapidStrip 210 ESversus100 ICP Fluorine

Axcelis RapidStrip 210 ES, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMAxcelisOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2007 Date of manufacture—
Control system——
Generation——
FamilyAxcelis RapidStrip 210 ESOxford Instruments 100 ICP Fluorine
Specifications
Part Number1080-6037[1]—
Software Version1.8.7.0.06[1]—
ConfigurationSystem On-Line[1]—
System TypeRapidStrip 210 ES[1]—
Number of Cassettes2[1]—
Load TypeStandard[1]—
Install TypeThrough-the-Wall[1]—
Robot TypeBrooks[1]—
Endpoint Detection TypeMonochromator[1]—
Throttle ValveMKS[1]—
Foreline ValveVAT[1]—
ManufacturerMatrix[1]—
Model3kW switchmode powergen[1]—
OEMAxcelis[1]—
CategoryEtch[2]—
Wafer size8 inch[1]4 inch, 6 inch, 8 inch (with clamp change)[4]
Cooling stationPresent[1]—
SECS/GEMSYes[1]—
Ozone / microwave generator manufacturerMatrix[1]—
Ozone / microwave generator model3kW switchmode powergen[1]—
PumpIQDP 80[1]—
Mechanical boosterQMB1200[1]—
System statusSystem on-line[1]—
CE markCertified[1]—
Can produce wafers as-isYes[1]—
All cables presentYes[1]—
System On-LineYes[1]—
CE Mark CertifiedYes[1]—
Cooling StationYes[1]—
Date of Manufacture2007-12-31[3]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[4]
Cryo DRIE etch rate—up to 5 µm/min[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]macquarie.commacquarie.com
  4. [4]nanofab.utah.edunanofab.utah.edu