Waferpedia

Comparison ledger

200 PCUversusNV GSD 200 Ion

Axcelis 200 PCU, Axcelis NV GSD 200 Ion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size—150mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Axcelis NV GSD 200
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]3 Phase[4]
Voltage400 V[3]208V, 710A[4]
Gases—B/As/Ar[4]
Total energy—200 KEV[4]
Throughput—210 pieces/hour[4]
Configuration—Features:[4]
Wafer size—6 inch[4]
Power—3 Phase, 208V, 710A[4]
Process gases—B/As/Ar[4]
SDS gas lines—2 lines (ASH3 and PH3)[4]
HP gas lines—2 lines (BF3 and ARGON)[4]
Cassette—25 slots, 4 cassettes capacity[4]
Source head—ELS source head[4]
Control hardware—2 SUN Workstations, VME 177 cell controller[4]
Post acceleration high voltage—80 KEV[4]
Drive—Belt type rotary drive[4]
Implant angle—Variable, 2-axis[4]
Dose controller—Real-time patented dose controller[4]
Dose range—5E11~1E16 Ions/cm2[4]
Arm—Std Arm 150mm[4]
Wafer holder—Std 150mm[4]
Beam energy—5 KeV[4]
Beam current—50 mA[4]
Electron shower—P-Shower electron shower[4]
CE marking—CE marked[4]
Beam Current—50 mACE marked[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing