Waferpedia

Comparison ledger

PAS 5500 300 C DUVversus017-0146-01 Prealigner

ASML PAS 5500 300 C DUV, Brooks 017-0146-01 Prealigner, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMASMLBrooks
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASML PAS 5500Brooks 017-0146-01 Prealigner
Cited variants
  • PAS 5500/300CDUV[1]
—
Specifications
ConfigurationCan be configured for 3" - 6"[1]—
OEMASML[1]—
ModelPAS 5500 / 300 C[1]—
Tool typeDUV Stepper (Deep Ultraviolet)[1]—
Wafer sizes8 inch[1]—
Exposure wavelength248 nm[2]—
Lens columnDUV (248nm), 0.63 N.A.[2]—
Reduction4:1[2]—
Exposure field sizeup to 22 mm square[2]—
Minimum feature size<0.20 µm[2]—
Wafer size range3 inch up to 200 mm[2]—
AlignmentRegistered alignment is typically <0.045 µm, even when using backside alignment[2]—
Mask size6 inch x 0.250 inch thick quartz masks[2]—
Stage motionlaser-controlled stage motion[2]—
Illuminationprogrammable annular illumination modes[2]—
Backside alignment3D-Align backside alignment[2]—
Exposure Wavelength248nm (DUV)[2]—
Lens Numerical Aperture0.63 - 0.40 variable[2]—
Reduction Ratio4:1[2]—
Exposure Field Size22 mm x 22 mm[2]—
Wafer Size Range3" up to 200mm[2]—
Registered AlgnmentTypically <0.045 µm[2]—
Mask Size6" x0.250"- thick quartz masks[2]—
Laser SourceCymr 5600 Laser[1]—
Wafter Size (from listing)8 inch[1]—
Vintage Year1996[1]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]cnfusers.cornell.educnfusers.cornell.edu