Comparison ledger
ASML 850 B KrF, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 850 B KrFASML | 101EV Group |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML 850 B KrF | EV Group 101 |
| Specifications | ||
| Configuration | 2 DFA Arm[1] | — |
| OEM | ASML[1] | EV Group[2] |
| Model | 850 B[1] | 101[2] |
| Tool type | KrF Scanner[1] | — |
| Asset # | 74588[1] | — |
| Configured components | 2 DFA Arm; 1 RH IRL IRIS; 2 Reticle Carrier; 1 Athena OM OM; Cymer ELS-600[1] | — |
| Vintage | 2009[1] | — |
| Equipment name | — | EVG 101 Spray Coater[2] |
| NEMO ID | — | evgspraycoat[2] |
| Training required | — | EVG 101 Training[2] |
| Training duration | — | 1.50 hours[2] |
| Processing technique | — | Resist Spray Coat (manual)[2] |
| Cleanliness | — | "All"[2] |
| Location | — | SNF Paul G Allen L107 Cleanroom[2] |
| Wafer diameter (substrate size) | — | up to 300 mm[3] |
| Available modules | — | Spin coat / OmniSpray® / develop[3] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[3] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[4] |
| Cleanliness group (at SNF) | — | "All"[2] |
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