Comparison ledger
ASM LinDA, Finetech Lambda, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LinDAASM | LambdaFinetech |
|---|---|---|
| OEM | ASM | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM LinDA | Finetech Lambda |
| Cited variants |
|
|
| Specifications | ||
| Voltage | 200 VAC, Single Phase[4] | — |
| Configuration | 50/60 Hz[4] | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[5] |
| Vintage (manufacture year) | 2012[4] | — |
| Machine type | Die bonder[1] | — |
| Category | Packaging & Bonding[1] | — |
| Power | 200 VAC, single phase, 50/60 Hz[4] | 80W Contact Chip Heater (CCH) with a single heated tool[5] |
| Vintage | 2012[4] | — |
| Accuracy | — | 0.5 um[5] |
| Placement Accuracy | — | 0.5 μm (sub-micron)[5] |
| Bond Force Range | — | 0.2-20 N[5] |
| Heating Plate Size | — | 50 × 50 mm[5] |
| Side Process Camera | — | Included[5] |
| Y Axis Camera Shifter | — | Included[5] |
| Fine Theta Adjustment on Bond Head | — | Included[5] |
| Dispense Syringe Mount Hardware | — | Included (no controller)[5] |
| Operating System | — | Windows 10 Pro[5] |
| Bonding Technologies | — | Thermocompression and ultrasonic[7] |
| Inert/Process Gas Enclosure | — | Included (on asset 153908)[6] |
| XY & Coplanarity Calibration Kit | — | Included (on asset 153908)[6] |
| Software | — | Finetech Software[5] |
| Placement Accuracy (description) | — | sub-micron[7] |
| Heating Plate | — | 50 x 50 mm with Gel/Waffle Pack station[5] |
| Control System | — | Windows 10 Pro PC[5] |
| Fine Theta Adjustment | — | Present on bond head[5] |
| Dispense Syringe Mount | — | Hardware only (no controller)[5] |
| Bond Line Adjust/Control Module | — | Present[5] |
| Contact Chip Heater | — | 80W (CCH) with single heated tool[6] |
| Substrate Heater (optional) | — | 100 x 100 mm with Gel/Waffle Pack station[5] |
| Placement accuracy | — | Sub-micron placement accuracy[7] |
| Bond technologies | — | Thermocompression and ultrasonic technologies[7] |
| Heating plate | — | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[5] |
| Bond force range | — | 0.2-20N Bond Force Module[5] |
| Bond head theta adjustment | — | Fine Theta Adjustment on Bond Head[5] |
| Vision | — | Side Process Camera[5] |
| Camera shifter | — | Y Axis Camera Shifter[5] |
| Adhesive dispensing hardware | — | Dispense Syringe Mount Hardware – no controller[5] |
| Process gas enclosure | — | Inert/Process Gas Enclosure[6] |
| Contact chip heater | — | 80W Contact Chip Heater (CCH) with a single heated tool[6] |
| Calibration kit | — | XY & Coplanarity calibration kit[6] |
| Control PC | — | Windows 10 Pro PC, Keyboard, Mouse & Monitor[5] |
| Bond line control | — | Bond Line Adjust/Control Module[5] |
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