Comparison ledger
ASM LinDA, Besi 2200 evo advanced, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | LinDAASM | |
|---|---|---|
| OEM | ASM | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM LinDA | Besi 2200 evo advanced |
| Cited variants |
|
|
| Specifications | ||
| Voltage | 200 VAC, Single Phase[4] | 400 VAC[5] |
| Configuration | 50/60 Hz[4] | — |
| Vintage (manufacture year) | 2012[4] | — |
| Machine type | Die bonder[1] | — |
| Category | Packaging & Bonding[1] | — |
| Power | 200 VAC, single phase, 50/60 Hz[4] | 2.3 kVA[5] |
| Vintage | 2012[4] | — |
| Type | — | G4[5] |
| Phase | — | 3 Phase[5] |
| Max Current | — | 3.3 A[5] |
| Main Breaker | — | D16 A[5] |
| SCCR | — | 5 kA[5] |
| Vacuum | — | -0.08 MPa[5] |
| Compressed Air | — | 0.60 MPa[5] |
| Nitrogen | — | 0.10 MPa[5] |
| Weight | — | 1,500 kg[5] |
| X/Y placement accuracy | — | ± 3 µm @ 3s[6] |
| Theta placement accuracy | — | ± 0.07° @ 3s[6] |
| Bond force range | — | 0.5N to 25N[6] |
| UPH die attach | — | up to 7,000 UPH/module[6] |
| UPH flip chip with dipping | — | up to 2,500 UPH/module[6] |
| UPH flip chip without dipping | — | up to 3,200 UPH/module[6] |
| Machine dimensions (L x D x H) | — | 1,160 mm x 1,225 mm x 1,750 mm[6] |
| Uptime | — | > 98 %[6] |
| Yield | — | > 99.95 %[6] |
| Die size die attach | — | 0.15 mm - 30 mm[6] |
| Die size flip chip | — | 0.5 mm - 30 mm[6] |
| Die thickness | — | >50 µm (thinner on request)[6] |
| Wafer size | — | 4" - 12" (SEMI M1)[6] |
| Frame sizes | — | FF070, FF105, FF108, FF123[6] |
| Substrate working range | — | 13" x 8" (325 mm x 200 mm)[6] |
| Heated bond head max temperature | — | 450°C[6] |
| UV curing power | — | up to 2,000 mW/cm2 (365 / 405 nm)[6] |
| Bond rotation | — | 0° - 360°[6] |
| Number of pickup tools/nozzles | — | up to 14[6] |
| Number of eject tools | — | 5[6] |
| Number of epoxies/adhesives in single pass | — | 3[6] |
| Bond force | — | 0.5 N – 25 N programmable[6] |
| Machine dimensions (LxDxH) | — | 1,160 mm x 1,225 mm x 1,750 mm[6] |
| Flip chip die size | — | 0.5 mm – 30 mm[6] |
| Heated bond head (optional) | — | up to 450 °C[6] |
| UV curing (optional) | — | up to 2,000 mW/cm² (365/405 nm)[6] |
| Supply voltage | — | 400 VAC, 3 phase, 50/60 Hz, 2.3 kVA[5] |
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