Waferpedia

Comparison ledger

Eagle Aeroversus101-149-053 Gold Booster

ASM Eagle Aero, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMASMBranson
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM Eagle AeroBranson 101-149-053 Gold Booster
Cited variants—
Specifications
Voltage110 VAC[2]—
ConfigurationSingle phase[2]1:1.5[5]
Equipment TypeAutomatic ball wire bonding system[3]—
Bonding TechnologyThermosonic with X-Power[1]—
TransducerAeroducer dual frequency (X and Y direction)[1]—
Bonded Ball Size22 µm[1]—
Wire Size0.5 mil[1]—
UPH ImprovementUp to 30% for typical Cu wire application[1]—
Wire MaterialsCopper wire, gold wire and compatible materials[3]—
ApplicationHigh-end IC semiconductor packaging[1]—
Power Requirements110 VAC, Single phase, 50/60Hz[2]—
Optical SystemDual magnification optical path, dual-color coaxial light[4]—
Manufacturer—Branson[6]
Model—101-149-053[6]
Type—Gold Booster[6]
Operating frequency—20 kHz[7]
Gain—1:1.5[6]
Mounting thread—1/2-20[7]
Length—5.4 in[7]
Gain ratio—1:1.5[6]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]semi.asmpt.comsemi.asmpt.com
  2. [2]inventory listing
  3. [3]wafer-equipment.comwafer-equipment.com
  4. [4]mono.ipros.commono.ipros.com
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]nextdayautomation.comnextdayautomation.com