Waferpedia

Comparison ledger

Eagle 60 APversus10100

ASM Eagle 60 AP, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM Eagle 60West Bond 10100
Specifications
Configuration50/60 Hz[1]—
Voltage240 V[1]—
Power supply240 V, 50/60 Hz, single phase[1]—
Electrical50/60 Hz, 240 V, Single Phase[1]—
Equipment typeWire bonder[2]—
MakeASM[2]—
ModelEagle 60 AP[2]—
Vintage2013[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing