Waferpedia

Comparison ledger

Vantage Radiance RTPversus1000 Hot Plate

Applied Materials Vantage Radiance RTP, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Vantage Radiance RTPApplied Materials
OEMApplied MaterialsCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Vantage RadianceCEE 1000 Hot Plate
Specifications
Configuration2 chambers[1]4"[2]
Type—Hot Plate[2]
Wafer Size—4 inch[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing