Waferpedia

Comparison ledger

Reflexion 3600versus1 DP 41

Applied Materials Reflexion 3600, Logitech 1 DP 41, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Reflexion 3600Applied Materials
1 DP 41Logitech
OEMApplied MaterialsLogitech
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials ReflexionLogitech 1 DP 41
Specifications
CE Segregation (NonCu/Open/Cu)Cu[1]—
ConfigurationSW version:[1]50/60 Hz[2]
Reflexion SoftwarePB59M3i2[1]—
MESA softwareCB22M3i2[1]—
ISRM softwareIB11g5b[1]—
FI robot type / controllerKawasaki[1]—
Load portTDK TAS 300 (2)[1]—
FI controllerAMAT VMICPCI-7326[1]—
Wet robot typeYaskawa WTM511-2-FWS02-V1-CU/0190-08246 (1)[1]—
Polisher MEI B/DAMAT 0100-00722 (3)[1]—
Polisher AIO B/DAMAT 0100-00396 (2)[1]—
Polisher DIO B/DAMAT 0100-01995 (7)[1]—
Platen DriverYaskawa SGDH-75 AE (3)[1]—
Cross DriverYaskawa SGDH-08 AE-S (1)[1]—
Pad Conditioner/HCLU DriverYaskawa SGDH-01 AE (7)[1]—
Head SWEEP DriverYaskawa SGDH-04 AE (4)[1]—
Head Rotation DriverSE 2 VOSTARCD CR 06250 (4)[1]—
Meg GeneratorKaijo 600 (1)[1]—
Mega HeaterOrion ETD 232-SA-A-UL (1)[1]—
Slurry arm TypeAMAT 0040-78378 (3)[1]—
MakeApplied Materials[1]Logitech[2]
ModelReflexion 3600[1]1 DP 41[2]
CategoryCMP (Chemical Mechanical Polisher)[1]—
CE SegregationCu[1]—
PC Arm assemblyAMAT 0010-25311 (3)[1]—
iScan EndPoint moduleAMAT 0010-37905[1]—
Vintage2011[1]—
Phase—3 Phase[2]
Voltage—480 V[2]
Frequency—50/60 Hz[2]
Current—12 amps[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing