Comparison ledger
Applied Materials Enabler, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EnablerApplied Materials | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Applied Materials | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2010 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Enabler | Oxford Instruments 100 ICP Fluorine |
| Cited variants | — | |
| Specifications | ||
| Manufacturer | Applied Materials[3] | — |
| Model | Enabler[3] | — |
| Category | Etcher[3] | — |
| Wafer size | 12 inch[3] | 4 inch, 6 inch, 8 inch (with clamp change)[5] |
| Description | Dielectric etcher[1] | — |
| Process chambers | 4[1] | — |
| Version | 300 mm[1] | — |
| Configured wafer size | 300 mm[4] | — |
| Process | OX[4] | — |
| Software revision | B2.8_79[4] | — |
| FI software | FB4.70_12[4] | — |
| GEM software | 7.20_17[4] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[5] |
| Cryo DRIE etch rate | — | up to 5 µm/min[5] |
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