Waferpedia

Comparison ledger

0041-26723 Bonded AssemblyversusAsymtek S 2 900 P Automated Fluid

Applied Materials 0041-26723 Bonded Assembly, Nordson Asymtek S 2 900 P Automated Fluid, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsNordson
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyNordson Asymtek
Specifications
Configuration—Heated Support Block[1]
Manufacturer—Nordson / Asymtek[1]
Model—S 2 900 P[1]
Tool type—Automated fluid dispenser[1]
Heated support block—Included[1]
Jetting head—IntelliJet jetting head[1]
Weight calibration scale—Included[1]
Laptop and software—Included with the system[1]
Last preventative maintenance—Performed on 6/17/25 by Nordson[1]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing