Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Nitto HR 8500 II UV Detaper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Nitto |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Nitto HR 8500 II UV Detaper |
| Specifications | ||
| Configuration | — | With UV Function[1] |
| Manufacturer | — | Nitto Denko[2] |
| Model | — | HR 8500 II UV[2] |
| UV function | — | With UV Function[2] |
| Manufacturer (alternate) | — | NITTO[3] |
| Part No. | — | HR8500-II UV[3] |
| Description (Korean) | — | Detaper撕膜机(带UV功能)[3] |
| Description | — | Detaper撕膜机(带UV功能) — detaper with UV function[3] |
| Condition | — | ASIS[3] |
| Quantity | — | 1[3] |
| Tool type | — | UV-equipped detaping tool[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →