Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Finetech Fineplacer 96, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Fineplacer 96Finetech |
|---|---|---|
| OEM | Applied Materials | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Wafer Ring Holder, |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Finetech Fineplacer 96 |
| Specifications | ||
| Configuration | — | Add On Option:[1] |
| Wafer size | — | Wafer Ring Holder,[2] |
| Tool type | — | Die bonder[2] |
| Category | — | Packaging & Bonding[2] |
| Optional modules | — | Flip Chip Module; Epoxy Dispenser Module; Pick & Place Module; UV Curing System; Heat Plate; Wafer Ring Holder; Accessories; Isolated Table[1] |
| Description | — | Manual FlipChip Bonder[3] |
| Available options | — | Die Attach; SMD; FLIP CHIP; UV Wafer Ring Release Module[3] |
| Bonding accuracy | — | 0.5 µm[3] |
| Max. die/package size | — | 16 mm (pick-n-place only)[3] |
| Min. die/package size | — | 0.5 mm[3] |
| Substrate size | — | 50 mm × 50 mm (thermal compression); 180 mm × 108 mm (pick-n-place only)[3] |
| Bonding environment | — | Nitrogen / formic acid[3] |
| Bonding mechanism | — | Thermo-compression; reflow; thermo-sonic[3] |
| Thermo-compression bonding force | — | 0.1 ~ 200 N[3] |
| Reflow temperature | — | RT ~ 400 °C[3] |
| Reflow heating rate | — | 20 °C/s[3] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →