Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, ASM AD 838, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | AD 838ASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | ASM AD 838 |
| Specifications | ||
| Wafer size | — | 8" wafer table[1] |
| Configuration | — | Epoxy dispensing[1] |
| Phase | — | 1 Phase[2] |
| Voltage | — | 220 Vac[2] |
| Tool function | — | Die bonder[2] |
| Wafer table size | — | 8 inches[1] |
| Epoxy dispensing | — | Yes[1] |
| Stack input | — | No[1] |
| Electrical supply phases | — | 1 phase[2] |
| Supply voltage | — | 220 Vac[2] |
| Supply frequency | — | 50/60 Hz[2] |
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