Waferpedia

Comparison ledger

0020 23839 PartversusSSC-600

Applied Materials 0020 23839 Part, CHA SSC-600, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsCHA
CategoryDepositionDeposition
Wafer size—6 in. system
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartCHA SSC-600
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]—
System type—Sputtering System[2]
Wafer size—6 in. system[2]
Operation—Sputter up or sputter down operations[2]
Baseplates—Upper and lower baseplates[2]
Cathodes—Up to four DC or RF cathodes[2]
Fixture—Single plane, multi substrate rotating fixture[2]
Control—Computer control[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org