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Comparison ledger

0020 18698 Partversus1000

Applied Materials 0020 18698 Part, CHA 1000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18698 PartApplied Materials
1000CHA
OEMApplied MaterialsCHA
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18698 PartCHA 1000
Specifications
ConfigurationDial Cover, Side Local Match, Hdpcvd, Ul[1]6 Pocket E-gun[2]
System Base Pressure—5x10^-7 Torr[2]
Category—Deposition[3]
Wafer size—5 inch[2]
Equipment type—Evaporator system[3]
E-gun—6-pocket[2]
Power supply—SR 10 Power Supply[3]
Wafer handling—Tri Dome System 5" wafers (21 wafers total)[2]
Pump down rate—to base pressure in under 60 minutes[2]
Deposition controller—Inficon Deposition Controller[2]
Rate controller—Inficon Dep Rate Controller[3]
Sensor—Single Crystal Sensor (Fix Top Mounted)[2]
Chamber—Water Cooled Chamber[2]
Automatic control—Automatic Pump Down and Regen Controller[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com