Waferpedia

Comparison ledger

0010 47763versusUnity ME 8555 SSS Dry

Applied Materials 0010 47763, Tokyo Electron Unity ME 8555 SSS Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Unity ME 8555 SSS DryTokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Tokyo Electron Unity
Specifications
Configuration2nd Source New[1]3 Ch Oxide[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]Unity ME 8555 SSS[4]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Manufacturer—Tokyo Electron[5]
Tool type—Dry Etcher[4]
Wafer size—8 inch[4]
Software version—1.00[4]
Condition note—Missing parts[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com