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Comparison ledger

0010 47763versusPlasmalab 100 ICP 180 RIE

Applied Materials 0010 47763, Oxford Instruments Plasmalab 100 ICP 180 RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
Plasmalab 100 ICP 180 RIEOxford Instruments
OEMApplied MaterialsOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Oxford Instruments Plasmalab 100
Specifications
Configuration2nd Source New[1]With VAT PM-5 Adaptive Pressure Controller[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]Plasmalab 100 ICP 180[4]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Voltage—208V, 50/60Hz[4]
Manufacturer—Oxford Instruments[4]
Tool type—Reactive Ion Etcher[4]
Category—Etch[5]
Wafer size—6 inch[4]
Power—208V, 50/60Hz[4]
Adaptive pressure controller—VAT PM-5[4]
Turbopump controller—Adixen ACT 1300M[4]
Vacuum pump—Leybold D65BCS with oil filter and exhaust filter[4]
Gas delivery—Gas Box[4]
Control computer—Control Computer (no HDD)[4]
Monitor—LCD Monitor[4]
Chiller—Thermo Neslab Chiller[4]
Computer cart—Computer Cart[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com