Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Kulicke & Soffa IConn ProCu Plus LA, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | IConn ProCu Plus LAKulicke & Soffa |
|---|---|---|
| OEM | Applied Materials | Kulicke & Soffa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | Kulicke & Soffa IConn |
| Specifications | ||
| Configuration | Refurbished[1] | for Parts[2] |
| Type | — | Fully automatic wire bonder[3] |
| Purpose | — | Make the electric connexion between the chip and the substratum with a gold or a copper wire[3] |
| Typical product | — | Typical ultra-fine pitch ball grid array product[3] |
| Minimum pad pitch | — | 35 µm[3] |
| Accuracy | — | 2 µm @ 3 sigma[3] |
| Minimum wire diameter | — | 0.6 mils[3] |
| Bond area | — | 56 mm x 87 mm[3] |
| Wire options | — | Copper wire option with forming gas[3] |
| Advanced node capability | — | Advanced node wafers down to 28 nm or below[3] |
| Process development/control | — | Wire pull and ball shear available[3] |
| Alternate wire option | — | Option de soudure de fil coincé sous capillaire (capillary wedge, wedge-to-wedge) with aluminum or gold wire[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →