Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual Heatedversus850 TBL

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, EV Group 850 TBL, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
850 TBLEV Group
OEMApplied MaterialsEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedEV Group 850
Specifications
ConfigurationRefurbished[1]Automated bonding system with Laminator[2]
Manufacturer—EV Group[3]
Model—850 TBL[3]
Vintage—2006[3]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing