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Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusAD 838

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM AD 838, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size—8"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedASM AD 838
Specifications
ConfigurationRefurbished[1]Epoxy dispensing[2]
Wafer size—8" wafer table[2]
Phase—1 Phase[3]
Voltage—220 Vac[3]
Tool function—Die bonder[3]
Wafer table size—8 inches[2]
Epoxy dispensing—Yes[2]
Stack input—No[2]
Electrical supply phases—1 phase[3]
Supply voltage—220 Vac[3]
Supply frequency—50/60 Hz[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing