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0010-22161 High EFF RF MatchversusJBX-8100FS

Applied Materials 0010-22161 High EFF RF Match, JEOL JBX-8100FS, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsJEOL
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FamilyApplied Materials 0010-22161 High EFF RF MatchJEOL JBX-8100FS
Cited variants—
Specifications
MakeApplied Materials[2]—
Model0010-22161[2]—
DescriptionHTESC PH 1 REV A[3]—
ConditionUsed[3]—
Stock NumberBM6628[3]—
machine type—maskless lithograph ML2 type[4]
emitter—patented ZrO/W (Schottky) emitter[4]
Emitter type—ZrO/W (Schottky) emitter[4]
Writing method—Spot beam, vector scan, step and repeat[1]
Accelerating voltage—100 kV (G1); 100/50 kV (G2); 200/130/100/50 kV (G3)[1]
Beam current range—5 × 10⁻¹² to 2 × 10⁻⁷ A[1]
Maximum scanning speed—125 MHz[1]
Field size (high resolution mode)—100 μm × 100 μm[5]
Field size (high throughput mode)—1,000 μm × 1,000 μm (G1/G2); 2,000 μm × 2,000 μm (G3)[1]
Stage movable area—190 mm × 170 mm[1]
Stage positioning resolution—0.6 nm (standard); 0.15 nm (optional)[1]
Overlay accuracy (high resolution mode)—≤±9 nm (G1/G2); ≤±8 nm (G3)[1]
Overlay accuracy (high throughput mode)—≤±20 nm[5]
Field stitching accuracy (high resolution mode)—≤±9 nm (G1/G2); ≤±8 nm (G3)[1]
Field stitching accuracy (high throughput mode)—≤±20 nm[5]
Minimum line width—8 nm[6]
Minimum step size—0.5 nm[6]
Substrate size—Maximum 200 mm φ wafer, 6 inch mask blanks, and micro sample pieces of any size[1]
Power consumption (normal operation)—Approximately 3 kVA[1]
Footprint (W × D × H)—4.9 m × 3.7 m × 2.6 m[1]
Electron source—ZrO/W (Schottky) thermal field emitter[4]
Sources (6)Every fact above is drawn from these public sources
  1. [1]jeol.comjeol.com
  2. [2]Equipment inventory listing
  3. [3]tarasemi.comtarasemi.com
  4. [4]en.wikipedia.orgen.wikipedia.org
  5. [5]jeolusa.comjeolusa.com
  6. [6]ncfl.ictas.vt.eduncfl.ictas.vt.edu