Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Fuji CP 642 Chip Shooter, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Fuji |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Fuji CP 642 Chip Shooter |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | With:[3] |
| Rated Speed | — | 40,000 CPH[4] |
| Placing Rate | — | 0.09 sec/component[4] |
| Placing Accuracy | — | ±0.01mm (3σ)[4] |
| PCB Dimensions Max | — | 457mm x 356mm[4] |
| PCB Dimensions Min | — | 80mm x 60mm[4] |
| Board Thickness | — | 0.3 to 4.0mm[4] |
| Component Capacity | — | Up to 140 types (8mm tape)[4] |
| Applicable Components | — | 0402 to 19mm x 20mm[4] |
| Maximum Component Height | — | 6mm[4] |
| Power | — | 3 phase 200 to 480 VAC, 10 kVA (1.25 kVA in power saving mode)[4] |
| Air Supply | — | 0.5 MPa (5 kgf/cm²)[4] |
| Machine Dimensions (L x W x H) | — | 4840mm x 1690mm x 1780mm[4] |
| Weight | — | Approx. 6000 kg[4] |
| Vintage | — | 1997[3] |