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0010-22161 High EFF RF MatchversusTopaz X II Placement

Applied Materials 0010-22161 High EFF RF Match, Assembleon Topaz X II Placement, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsAssembleon
Category——
Wafer size——
Process node——
Introduced——
Production run——
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FamilyApplied Materials 0010-22161 High EFF RF MatchAssembleon Topaz X II Placement
Cited variants—
  • Topaz-XII with FNC head (PA 1314/01)[1]
  • Topaz-XII with SF head (PA 1314/02)[1]
Specifications
MakeApplied Materials[2]—
Model0010-22161[2]—
DescriptionHTESC PH 1 REV A[3]—
ConditionUsed[3]—
Stock NumberBM6628[3]—
Phase—3 Phase[4]
Frequency—60 Hz[4]
Placement Speed (optimal)—20,000 CPH[5]
Placement Speed (IPC 9850)—15,400 CPH[5]
Placement Accuracy (3σ, chips)—±50 µm[5]
Placement Accuracy (3σ, QFP 0.4mm pitch)—±35 µm[5]
Maximum Board Size (L x W)—460 x 440 mm[5]
Minimum Board Size (L x W)—50 x 50 mm[5]
Large Board Application—650 x 850 mm[5]
Board Thickness—0.4 to 4.0 mm[5]
Component Range—01005 (0402) to 45 x 100 mm (BGA, µBGA, CSP, Connector, Odds)[5]
Maximum Component Height—11 mm (with area CCD camera)[5]
Head Design (SF)—One single beam with 8 super fine heads[5]
Head Design (FNC)—One single beam carrying 4 standard heads and 4 heads with nozzle exchange on-the-fly[5]
Footprint (L x W)—1650 x 1408 mm[5]
Operating System—Windows NT[5]
Tape Feeding Positions (8mm)—90 (CLi) or 160 (ITF)[5]
Tray Feeding—LCS tray feeder with 40 pallets, single ATS tray feeder with 20 pallets[5]
Feeder Trolleys—4 x 20 position (CLi) or 4 x 20 position (ITF)[5]
Alignment Principle—Line array camera, area CCD camera, co-planarity check on-the-fly[5]
Sources (5)Every fact above is drawn from these public sources
  1. [1]scribd.comscribd.com
  2. [2]Equipment inventory listing
  3. [3]tarasemi.comtarasemi.com
  4. [4]inventory listing
  5. [5]efsmt.comefsmt.com