Comparison ledger
Applied Materials 0010-21246 Part, Lam Research TCP9100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-21246 PartApplied Materials | TCP9100Lam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Lam Research TCP9100 |
| Specifications | ||
| Tool type | — | etcher[1] |
| Use case | — | plasma etching of CYCLOTENE films[1] |
| Example process pressure | — | 10 mTorr[1] |
| Example TCP power | — | 1500 W[1] |
| Example RF power | — | 700 W[1] |
| Example O2 flow | — | 18 sccm[1] |
| Example C2F6 flow | — | 2 sccm[1] |
| Example N2 flow | — | 40 sccm[1] |
| Example application | — | sub-micron BCB via profile etch[1] |