Waferpedia

Comparison ledger

0010-18024 Pyrometer AssemblyversusF50-UV

Applied Materials 0010-18024 Pyrometer Assembly, Filmetrics F50-UV, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
F50-UVFilmetrics
OEMApplied MaterialsFilmetrics
CategoryMetrology & InspectionMetrology & Inspection
Wafer size—8"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-18024 Pyrometer AssemblyFilmetrics F50-UV
Specifications
ConfigurationCapable of working on Applied Materials Radiance[1]—
Vendor—Filmetrics[2]
Model—Filmetrics F50-UV[2]
Measurement method—spectroscopic reflectometry[3]
Function—thin-film thickness and optical characteristics measurement[2]
Automated stage—yes[2]
Sample size—up to 8 inches in diameter[2]
Substrate size—~5 mm × 5 mm to 200 mm diameter[3]
Thickness measurement range—5 nm – 40 µm[3]
Minimum thickness to measure n and k—50 nm[3]
Wavelength range—190–1100 nm[3]
Spot size—1.5 mm[3]
Light source—deuterium + tungsten-halogen (dual light source; may choose one or both lamps)[3]
Measurement results visualization—2D and 3D[3]
Measurement results visualisation—2D and 3D[3]
Wafer handling—Up to 8"[2]
Sample stage—Fully automated[2]
Measurement rate—up to 2 points per second[2]

Plan your fab

Building a Metrology & Inspection process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]uwaterloo.cauwaterloo.ca
  3. [3]confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca