Waferpedia

Comparison ledger

0010-18024 Pyrometer AssemblyversusSE500-II

Applied Materials 0010-18024 Pyrometer Assembly, CyberOptics SE500-II, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
SE500-IICyberOptics
OEMApplied MaterialsCyberOptics
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-18024 Pyrometer AssemblyCyberOptics SE500-II
Specifications
ConfigurationCapable of working on Applied Materials Radiance[1]—
Board Size (Max.)—510 x 510 mm[2]
Board Size (Min.)—50 x 50 mm[2]
Inspection Speed @ 30µm—80cm²/sec[2]
Inspection Speed @ 15µm—50cm²/sec[2]
Gage R&R—<10%, 6σ[2]
Sensor—Exclusively designed and built by CyberOptics[2]
Scan sequence—Unique 'all-in-one' scan sequence[2]
Software—SPI V5 software[2]
Board Edge Clearance (Top)—2.5 mm (0.10 in.)[3]
Board Edge Clearance (Bottom)—3.0 mm (0.12 in.)[3]
Component Clearance (Top above belt)—20.1 mm (0.78 in.)[3]
Component Clearance (Bottom)—25.4 mm (1.0 in.)[3]
Conveyor Speed—150 - 450 mm/sec (5.9-17.7 in./sec)[3]
Dimensions—39.5" x 50" x 55" H[3]
Weight—1,433 lbs[3]
Inspection type—3D solder paste inspection[3]
Max board size—510 x 510 mm[2]
Min board size—50 x 50 mm[2]
Conveyor speed—150 - 450 mm/sec[3]
Conveyor width adjust—Automatic SMEMA[3]
Board edge clearance top—2.5 mm[3]
Board edge clearance bottom—3.0 mm[3]
Component clearance top (above belt)—20.1 mm[3]
Component clearance bottom—25.4 mm[3]
Condition wording—Complete & Operational[4]

Plan your fab

Building a Metrology & Inspection process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]wotol.comwotol.com
  4. [4]bajabid.combajabid.com