Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusTrias 200 SPA

Applied Materials 0010-16392 ESC Assembly, Tokyo Electron Trias 200 SPA, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
Trias 200 SPATokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyTokyo Electron Trias 200 SPA
Cited variants—
  • TEL Trias 200 SPA (Dry Etch)[1]
  • TEL Trias 200 SPA (CVD)[2]
Specifications
OEMApplied Materials[3]—
Model0010-16392[3]—
TypeESC Assembly[3]—
Wafer Size300 mm[4]300 mm[1]
Electrode ConfigurationDual[4]—
Process Type—Dry Etch[1]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]Equipment inventory listing
  4. [4]spwindustrial.comspwindustrial.com