Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Plasma-Therm Shuttleline ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | Shuttleline ICPPlasma-Therm |
|---|---|---|
| OEM | Applied Materials | Plasma-Therm |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Plasma-Therm Shuttleline ICP |
| Specifications | ||
| OEM | Applied Materials[1] | — |
| Model | 0010-16392[1] | — |
| Type | ESC Assembly[1] | — |
| Wafer Size | 300 mm[2] | 6 inch[3] |
| Electrode Configuration | Dual[2] | — |
| Configuration | — | Etched III-V materials[3] |
| Etched Materials | — | III-V materials[3] |
| External pumps and chiller | — | Not included[3] |
| Tool type | — | Inductively coupled plasma etcher[3] |
| Process material | — | III-V materials[3] |
| Vacuum & pumping | — | External pumps and chiller not included[4] |
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