Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Applied Materials DPS II, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | DPS IIApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Applied Materials DPS |
| Cited variants | — |
|
| Specifications | ||
| OEM | Applied Materials[2] | Applied Materials[4] |
| Model | 0010-16392[2] | DPS II[4] |
| Type | ESC Assembly[2] | — |
| Wafer Size | 300 mm[3] | — |
| Electrode Configuration | Dual[3] | — |
| Configuration | — | Load port (3)[4] |
| Category | — | Etch[1] |
| Wafer size | — | 12 inch[4] |
| Tool class | — | second-generation 300mm tool[5] |
| Process capability | — | silicon or metal etch[5] |
| Scaleability | — | scaleable for 200mm wafers[5] |
| Onboard subsystems | — | controller, endpoint, and gas panel located onboard the tool[5] |
| Footprint | — | 20 percent smaller than previous 200mm DPS models[5] |
| Demonstrated CD uniformity | — | less than 10nm across a 300mm wafer, including the edge die[5] |
| Demonstrated metal etch CD uniformity | — | less than five-percent from wafer to wafer and chamber to chamber[5] |
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