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Comparison ledger

0010-13622 RF Match forversusM 2 i

Applied Materials 0010-13622 RF Match for, Varian M 2 i, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
M 2 iVarian
OEMApplied MaterialsVarian
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forVarian M 2 i
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]With:[2]
Model0010-13622[1]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
Equipment type—Sputtering system[2]
Wafer size—6 inch[2]
Included components—Alpha computer; load lock; turbo pump; Edwards dry pump; turbo controller; VME computer; orienter; hand off station; cryo pump; load arm; DCM servo controller; transfer servo controller; power supply; gas controller; ion gauge controller; compressor; chiller[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing