Comparison ledger
Applied Materials 0010-13622 RF Match for, Temescal FC-2800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | FC-2800Temescal |
|---|---|---|
| OEM | Applied Materials | Temescal |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Temescal FC-2800 |
| Cited variants | — | |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[2] | — |
| Model | 0010-13622[2] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[2] | — |
| Feature | High Efficiency HE RF Match-Bias[2] | — |
| Type | — | Deposition system[1] |
| Use case | — | Mid-sized coater for production and large-wafer R&D[1] |
| Clean room compatibility | — | Clean room-compatible[1] |
| Load-lock status | — | Load-locked FC-2800[1] |
| Product chamber dimensions | — | 28 in high x 28 in x 28 in; 28 in (711 mm) cubic[1] |
| Standard source-to-substrate distance | — | 34 in[1] |
| Optional source-to-substrate distance | — | 42 in with optional source well extension collar[1] |
| Source trays | — | Support multiple e-beam and resistance sources[1] |
| Cryopumps | — | Product and source chamber cryopumps[1] |
| Control system | — | Temescal Control System (TCS) with Auto, Manual, and Service Modes plus process datalogging[1] |
| Deposition controller | — | Inficon XTC/3 deposition controller[1] |
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