Comparison ledger
Applied Materials 0010-13622 RF Match for, Denton Vacuum Discovery 18, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Discovery 18Denton Vacuum |
|---|---|---|
| OEM | Applied Materials | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | — | 6-inch diameter stage |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Denton Vacuum Discovery |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Deposition type | — | Sputter deposition of metals, alloys, and insulating thin films[2] |
| Film thickness range | — | From a few nm to hundreds of nm[2] |
| Cathodes | — | Three 3-inch diameter confocal cathodes[2] |
| RF power supplies | — | 2 RF power supplies[2] |
| DC power supply | — | Switchable DC power supply[2] |
| Co-sputter capability | — | Yes[2] |
| Reactive sputtering | — | Available with nitrogen or oxygen[2] |
| Stage diameter | — | 6-inch diameter stage[2] |
| Substrate rotation uniformity | — | +/- 10%[2] |
| Pump system | — | Cryo and turbo pumped[2] |
| Base pressure | — | 1 x 10^7 Torr[2] |
| Substrate heating | — | Up to 200 C[2] |
| Liftoff deposition | — | Available with sputter power[2] |
| Argon pressure range | — | 3-15 mT controllable with 200 sccm MFC controller[2] |
| Number of cathodes | — | 3[2] |
| Cathode diameter | — | 3 inches[2] |
| Co-sputtering capability | — | Yes[2] |
| Substrate rotation | — | Yes[2] |
| Uniformity | — | +/- 10%[2] |
| Pumping system | — | Cryo and turbo pumped[2] |
| MFC controller | — | 200 sccm (no APC valve)[2] |
| Deposition technique | — | Sputter deposition of metals, alloys, and insulating thin films (user configurable)[2] |
| Film thickness control | — | Controllable from a few nm to hundreds of nm[2] |
| Power supplies | — | 2 RF power supplies; switchable DC power supply[2] |
| Substrate stage size | — | 6-inch diameter stage[2] |
| Chamber material | — | 304L SS, 18" Diameter x 13.5" Deep[3] |
| Baseplate material | — | 304L SS, 20" Diameter[3] |
| High vacuum pump | — | 140 l/s Turbomolecular Pump[3] |
| Mechanical pump | — | 11 cfm[3] |
| Control cabinet | — | Single 19" Standard EIA Rack, with Single Point Power Connection[3] |
| High vacuum gauge | — | Digital Cold Cathode Auto-Ranging[3] |
| Control type | — | PLC Control of Auto Pump Sequence[3] |
| Feedthroughs | — | Baseplate (15) 1.0", (2) 2.75" Conflats, (2) 1.33" Conflats[3] |
| Floor space | — | 96" Wide x 48" Deep[3] |
| Chamber viewpoints | — | (1) 4.0" Diameter High Vacuum Valve Horizontal, 5.75" Diameter Bellows Sealed[3] |
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