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Comparison ledger

0010-03254 E Chuckversus5100

Applied Materials 0010-03254 E Chuck, KLA 5100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
5100KLA
OEMApplied MaterialsKLA
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—KLA 5100
Cited variants—
  • 5100 XP Overlay Measurement[1]
Specifications
Step measurement range—100 Å to 300 µm[2]
Sample table—200 mm with vacuum[2]
Maximum sample thickness—20 mm[2]
Minimum sample length—25 mm[2]
Wafer handling—Dual SMIF Cassette loader, 200mm[2]
Optics—12k and 750 micron FOV optical microscopes with light source[2]
Microscope—50 micron FOV with optical measurement, interferometer measurement, and autofocus[2]
Software—Windows NT / VAX[2]
Operating system—VMS[2]
Backup—SCSI back up unit[2]
Printer—Thermal mini printer[2]
Tool type—metrology and inspection tool[2]
Measurement application—overlay measurement on wafers[2]
Wafer size—8-inch wafers[2]
Optical system—optical microscopes for measurement functions[2]
Microscope set—12k microscope and a 750 micron field-of-view microscope with a light source[2]
Microscope functions—50 micron field-of-view microscope performs optical measurement, interferometer measurement, and autofocus[2]
Measurement range—100 Å to 300 µm[2]
Control software—Windows NT / VAX software[2]
Backup unit—SCSI Back up unit[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]waferpedia.comwaferpedia.com