Waferpedia

Comparison ledger

0010-03254 E Chuckversus9500 XR 200 S

Applied Materials 0010-03254 E Chuck, Applied Materials 9500 XR 200 S, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-03254 E ChuckApplied Materials
9500 XR 200 SApplied Materials
OEMApplied MaterialsApplied Materials
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Applied Materials PI 9500
Specifications
Phase—3 Phase + Neutral[1]
Configuration—50/60 Hz[1]
Voltage—208 V[1]
CPU—MVME162-P244LSE[1]
Software—4.06[1]
BF3—SDS[1]
PH3—SDS[1]
AsH3—SDS[1]
SiF4—SDS[1]
Argon—External Feed[1]
Chamber—CT-10 Cryos[1]
Source Turbo—STP-1000C[1]
Mrs Turbo—STP-361C[1]
Source Backing—QDP40[1]
Wafer Loader—QDP80 w/ EH500 Blower[1]
Source Type—IHC[1]
Oven Capabilities—Oven fitted to source[1]
Wafer Sizes—6 inch[1]
Power—3 Phase + Neutral - 50/60 Hz - 208 V[1]
Gas Box Gases—BF3: SDS, PH3: SDS, AsH3: SDS, SiF4: SDS, Argon: External Feed[1]
Enlarged Chamber—Yes[1]
Source Magnet—40A[1]
Extraction—Dual Bellows 60kV[1]
Post Acell—160kV max[1]
Total Energy—200kV max[1]
Plasma Flood Gun—HDPFS[1]
Wheel—Direct Drive[1]
Tilt—0 to 7[1]
Orient—fitted, not in use[1]
Flat Not Found Sensor—fitted, not in use[1]
Gripper—Hollow[1]
Wafer on Gripper Sensor—2000 Vintage[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing