Waferpedia

Comparison ledger

M Prep 3versus15 Lapper

Allied High Tech M Prep 3, Lapmaster 15 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
M Prep 3Allied High Tech
15 LapperLapmaster
OEMAllied High TechLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAllied High Tech M Prep 3Lapmaster 15
Specifications
ConfigurationParts Unit[1]Equipped with:[3]
OEMAllied High Tech[1]—
ModelM Prep 3[1]—
CategoryCMP[2]—
Tool typeGrinder / Polisher[1]—
Wafer size8 inch[1]—
Number Of Conditioning Rings—Up to 3[3]
Ring ID—Up to 5.5″[3]
Plate Diameter – Outside—15″[3]
Plate Diameter – Inside—3 1/2″[3]
Standard RPM—60[3]
Drive Motor—1/2 HP[3]
Electrics—110V / 1Ph / 60Hz[3]
Dimensions – Approximate—26″(L-R) x 21″(F-B) x 22″(H)[3]
Equipped with: 15″ Cast Iron Plate—Included[3]
Equipped with: (3) Yoke/Roller Bearing Assemblies—Included[3]
Equipped with: (3) Conditioning Rings—Included[3]
Equipped with: (3) Hold Downs—Included[3]
Equipped with: 30 Minute Timer—Included[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing