Waferpedia

Comparison ledger

UF 200 SversusRS50

Accretech UF 200 S, Filmetrics RS50, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UF 200 SAccretech
RS50Filmetrics
OEMAccretechFilmetrics
CategoryTest & ProbeTest & Probe
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 200Filmetrics RS50
Specifications
AirOver 0.45 MPa[1]—
VacuumOver -53K MPa[1]—
Voltage208 VAC, Single Phase[1]—
Frequency50/60Hz[1]—
Wiring Configuration2Wire + Ground[1]—
Full Load AMPS7.2A[1]—
Main Breaker Rating10A[1]—
Interrupt Current10KA A.I.C[1]—
Diagram NumberFE06000[1]—
ConfigurationYield Check Function[1]—
Loader, Wafer HandlingBackside Holding[1]—
Wafer Size5",6",8", Currently 8"(200mm) Configured[1]—
X/Y axisProbing Area(±120mm), Maximum Speed(200m/s)[1]—
Power ConsumptionApproximately 1.5kVA[1]—
Air Supply Source Pressure0.45Mpa or more[1]—
ManipulatorMHF300L[1]—
Weight (Main Body)900kg (Standard)[1]—
Type—4 Point Probe System Mapping 4 point Probe system[2]
Sheet resistance range—1 mohm/sq to 200 Mohm/sq[2]
Wafer capability—200 mm wafers capable[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]cnf.cornell.educnf.cornell.edu