Waferpedia

Comparison ledger

UF 200 SversusEG4

Accretech UF 200 S, Electroglas EG4, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UF 200 SAccretech
EG4Electroglas
OEMAccretechElectroglas
CategoryTest & ProbeTest & Probe
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 200Electroglas EG4
Cited variants—
Specifications
AirOver 0.45 MPa[2]—
VacuumOver -53K MPa[2]—
Voltage208 VAC, Single Phase[2]—
Frequency50/60Hz[2]—
Wiring Configuration2Wire + Ground[2]—
Full Load AMPS7.2A[2]—
Main Breaker Rating10A[2]—
Interrupt Current10KA A.I.C[2]—
Diagram NumberFE06000[2]—
ConfigurationYield Check Function[2]—
Loader, Wafer HandlingBackside Holding[2]—
Wafer Size5",6",8", Currently 8"(200mm) Configured[2]—
X/Y axisProbing Area(±120mm), Maximum Speed(200m/s)[2]—
Power ConsumptionApproximately 1.5kVA[2]—
Air Supply Source Pressure0.45Mpa or more[2]—
ManipulatorMHF300L[2]—
Weight (Main Body)900kg (Standard)[2]—
MakeAccretech / TSK[3]—
ModelUF 200 S[3]—
Wafer Sizes8 inch[3]—
HOT ChuckPresent[2]—
GPIB InterfacePresent[2]—
Yield Check FunctionPresent[2]—
FAIL Check FunctionPresent[2]—
Type—wafer prober[5]
Wafer size—200mm[5]
Z-force—up to 150 kilograms[5]
Z-drive—probe-centered Z-drive[5]
Z-drive type—Probe centered Z-drive[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]web.archive.orgweb.archive.org