Waferpedia

Comparison ledger

UF 200 Sversus103-754

Accretech UF 200 S, Cascade Microtech 103-754, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UF 200 SAccretech
103-754Cascade Microtech
OEMAccretechCascade Microtech
CategoryTest & ProbeTest & Probe
Wafer size200mm6-inch diameter microchamber and thermal chuck
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 200Cascade Microtech 103-754
Specifications
AirOver 0.45 MPa[1]—
VacuumOver -53K MPa[1]—
Voltage208 VAC, Single Phase[1]—
Frequency50/60Hz[1]—
Wiring Configuration2Wire + Ground[1]—
Full Load AMPS7.2A[1]—
Main Breaker Rating10A[1]—
Interrupt Current10KA A.I.C[1]—
Diagram NumberFE06000[1]—
ConfigurationYield Check Function[1]—
Loader, Wafer HandlingBackside Holding[1]—
Wafer Size5",6",8", Currently 8"(200mm) Configured[1]—
X/Y axisProbing Area(±120mm), Maximum Speed(200m/s)[1]—
Power ConsumptionApproximately 1.5kVA[1]—
Air Supply Source Pressure0.45Mpa or more[1]—
ManipulatorMHF300L[1]—
Weight (Main Body)900kg (Standard)[1]—
type—x-y-z-θ probe positioner[2]
installed on—HFTL 50-GHz Small-Signal Probe Station[2]
quantity in station—two[2]
station chuck size—6-inch-diameter microchamber and thermal chuck[2]
Quantity per station—Two positioners[2]
Chuck size—6-inch-diameter microchamber and thermal chuck[2]
Temperature range—-50 to 200 °C[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]cnf.cornell.educnf.cornell.edu