Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF200, KLA Flexus F 2320 I Stress Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF200Accretech | |
|---|---|---|
| OEM | Accretech | KLA |
| Category | — | — |
| Wafer size | Wafer Equipment | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1991 Vintage |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF200 | KLA Flexus F 2320 I Stress Measurement |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | This system comes with an alignment/centering ring for a 6" wafer[2] |
| Date of Manufacture | 1998[1] | — |
| Currently Configured for | 200mm[1] | — |
| Current Equipment Status | Available[1] | — |
| Available date | Currently Available[1] | — |
| Equipment category | Production Wafer Prober[1] | — |
| Configuration | — | Dual Wavelength[2] |
| Software Version | — | 2.0[2] |
| Operating System | — | MS-DOS V6.22[2] |
| Voltage | — | 115V[2] |
| Current | — | 10A[2] |
| Wafer Sizes | — | 6 inch, 8 inch[2] |
| Vintage | — | 1991[2] |
| Measurement | — | Dual Wavelength[2] |